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 HV302 HV312
__________________________________________________________________________________________________________________
Initial Release
Sequencing Hotswap Controllers
(Negative Supply Rail) Features
-10V to 90V or +10V to +90V Operation Four PWRGD Flags with Programmable Delays Integrated "normally-on" Gate Clamp eliminates components UV/OV Lock Out & Power-On-Reset (POR) for Debouncing Sense resistor programmed Circuit Breaker & Servo Limit Programmable Circuit Breaker Delay Inrush control using either: Servo or Feedback Capacitor Feedback to RAMP pin saves gate protection components 100ms Start Up Timeout Protection for Output Overload Programmable Inrush Current di/dt Control Programmable Auto-Retry (tens of seconds if desired) Auto-Retry or Latched Operation Application solution for input voltage step (diode "ORing") Enable through Open Drain interface to UV or OV Low Power, 0.6mA Active Mode, 0.4mA Sleep Mode Small SOIC-14 Package
General Description
The HV302 and HV312 Hotswap Controllers perform current limiting, circuit breaker protection, over and under voltage detection power management functions during insertion of cards or modules into live backplanes and connectors. They may be used in systems where active control is implemented in the negative lead of supplies ranging from -10V to -90V or +10V to +90V. During initial power application the external pass device is held off by a "normally-on" circuit that clamps its gate low. Thereafter UV/OV and power-on-reset work together to suppress gate turn on due to contact bounce. When stable connection has been established for the duration of a programmed time delay, the inrush current is controlled and limited to a programmed level using one of two possible methods; servo mode or drain to ramp feedback capacitor mode. When charging of the load capacitor is completed, the open drain PWRGD-A flag is asserted. Open drain PWRGD-B, PWRGD-C and PWRGD-D flags are asserted sequentially after the expiration of their respective programmed time delays. Thereafter it transitions to a low power sleep mode and continues to monitor current and input voltage. If full charging of the load capacitor is not achieved within 100ms or the circuit breaker is tripped at any time, the external pass device is turned off and all four PWRGD flags are reset to the inactive state. Thereafter a programmable auto-retry timer will hold the pass device off to allow it to cool before resetting and initiating autoretry. The auto-retry can be disabled using a single resistor if desired.
Applications
-48V Telecom and Networking -24V Cellular and Fixed Wireless Systems -24V PBX Systems Power Over LAN (IEEE802.3) Distributed Power Systems Power Supply Control +48V Servers and SANs Hotswap Control of Diode ORed Multiple Power Sources Cooling Fan Systems
Typical Application Circuit and Waveforms
GND 14 VDD R1 487k R2 6.81k 5 R3 9.76k -48V TB 11 RTB TC 12 RTC TD 13 RTD C1 10nF R4 0.0125 Q1 IRF530 RAMP 10 VEE 7 SENSE 8 GATE 9 100uF ___ EN / EN DC/DC PWM CONVERTER C2 0.75nF ___ EN / EN DC/DC PWM CONVERTER +5V COM OV ________ PWRGD-D / PWRGD-D ________ PWRGD-C /PWRGD-C ________ PWRGD-B / PWRGD-B ________ PWRGD-A / PWRGD-A 1 2 3 4
___ EN / EN DC/DC PWM CONVERTER ___ EN / EN Cload DC/DC PWM CONVERTER
-12V COM
6
UV
HV302 / HV312
+12V COM
+3.3V COM
NOTES:
1. 2. 3. 4.
Under Voltage Shutdown (UV) set to 35V. Over Voltage Shutdown (OV) set to 65V. Current Limit set to -1A. Circuit Breaker set to 8A.
1
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Absolute Maximum Ratings
VEE reference to VDD pin VPWRGD referenced to VEE Voltage VUV and VOV referenced to VEE Voltage Operating Ambient Temperature Operating Junction Temperature Storage Temperature Range +0.3V to -100V -0.3V to +100V -0.3V to +12V -40C to +85C -40C to +125C -65C to +150C
Ordering Information
Active State of Power Good Flags HIGH LOW Package Options 14 Pin SOIC HV302NG HV312NG
Electrical Characteristics (-10V
Symbol Parameter
VIN
-90V, -40C Min
TA
+85C unless otherwise noted) Typ Max Units Conditions
Supply (Referenced to VDD pin)
VEE IEE IEE Supply Voltage Supply Current Sleep Mode Supply Current (Referenced to VEE pin) UV High Threshold UV Low Threshold UV Hysteresis UV Input Current OV High Threshold OV Low Threshold OV Hysteresis OV Input Current (Referenced to VEE pin) Current Limit Threshold Voltage Circuit Breaker Current Limit Threshold Voltage -90 600 400 -10 700 450 V A A VEE = -48V, Mode = Limiting VEE = -48V, Mode = Sleep
OV and UV Control
VUVH VUVL VUVHY IUV VOVH VOVL VOVHY IOV
1.26 1.16 100 1.0 1.26 1.16 100 1.0
V V mV nA V V mV nA
Low to High Transition High to Low Transition VUV = VEE + 1.9V Low to High Transition High to Low Transition VOV = VEE + 0.5V
Current Limit
VSENSE-CL VSENSE-CB
40 80
50 100
60 120
mV mV
VUV = VEE + 1.9V, VOV = VEE + 0.5V VUV = VEE + 1.9V, VOV = VEE + 0.5V
Gate Drive Output
VGATE IGATEUP IGATEDOWN
(Referenced to VEE pin) Maximum Gate Drive Voltage Gate Drive Pull-Up Current Gate Drive Pull-Down Current
8.5 500 40
10
12
V A mA
VUV = VEE + 1.9V, VOV = VEE + 0.5V VUV = VEE + 1.9V, VOV = VEE + 0.5V VUV = VEE, VOV = VEE + 0.5V
Ramp Timing Control
IRAMP tPOR tRISE tLIMIT tPWRGD-A tPWRGD-B tPWRGD-B tPWRGD-C tPWRGD-C tPWRGD-D tPWRGD-D VRAMP tSTARTLIMIT tCBTRIP tAUTO
Test Conditions: CLOAD=100F, CRAMP=10nF, VUV = VEE + 1.9V, VOV = VEE + 0.5V, External MOSFET is IRF530* Ramp Pin Output Current 10 VSENSE = 0V A Time from UV to Gate Turn On 2.0 ms (See Note 1) Time from Gate Turn On to VSENSE Limit 400 s Duration of Current Limit Mode 5.0 ms Time from Current Limit to PWRGD-A 5.0 ms Maximum Time from PWRGD-A to PWRGD-B 150 200 250 ms RTB = 120k Minimum Time from PWRGD-A to PWRGD-B 3.0 5.0 8.0 ms RTB = 3k Maximum Time from PWRGD-B to PWRGD-C 150 200 250 ms RTC = 120k Minimum Time from PWRGD-B to PWRGD-C 3.0 5.0 8.0 ms RTC = 3k Maximum Time from PWRGD-C to PWRGD-D 150 200 250 ms RTD = 120k Minimum Time from PWRGD-C to PWRGD-D 3.0 5.0 8.0 ms RTD = 3k Voltage on Ramp Pin in Current Limit Mode 3.6 V (See Note 2) Start up Time Limit 80 100 120 ms Circuit Breaker Delay Time 2.0 5.0 May be extended by external RC circuit s Automatic Retry Delay 16 s
-
2
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Power Good Outputs
VPWRGD-x(hi) VPWRGD-x(lo) IPWRGD-x(lk)
(Referenced to VEE pin) Power Good Pin Breakdown Voltage Power Good Pin Output Low Voltage Maximum Leakage Current
90 0.5 <1.0 0.8 10
V V A
PWRGD-x = HI Z IPWRGD = 1mA, PWRGD-x = LOW VPWRGD = 90V, PWRGD-x = HI Z
Dynamic Characteristics
tGATEHLOV tGATEHLUV OV Comparator Transition UV Comparator Transition 500 500 ns ns
Note 1: This timing depends on the threshold voltage of the external N-Channel MOSFET. The higher its threshold is, the longer this timing. Note 2: This voltage depends on the characteristics of the external N-Channel MOSFET. Vto = 3V for an IRF530. *IRF530 is a registered trademark of International Rectifier.
Pinout
PWRGD-D (HV302) ________ PWRGD-D (HV312) PWRGD-C (HV302) ________ PWRGD-C (HV312) PWRGD-B (HV302) ________ PWRGD-B (HV312) PWRGD-A (HV302) ________ PWRGD-A (HV312) OV
Pin Description
PWRGD-D - This Power Good Output Pin is held inactive on initial power application and goes active a programmed time delay after PWRGD-C goes active. PWRGD-C - This Power Good Output Pin is held inactive on initial power application and goes active a programmed time delay after PWRGD-B goes active. PWRGD-B - This Power Good Output Pin is held inactive on initial power application and goes active a programmed time delay after PWRGD-A goes active. PWRGD-A - This Power Good Output Pin is held inactive on initial power application and goes active when the external MOSFET is fully turned on. OV - This Over Voltage (OV) sense pin, when raised above its high threshold will immediately cause the GATE pin to be pulled low. The GATE pin will remain low until the voltage on this pin falls below the low threshold limit, initiating a new start-up cycle. UV - This Under Voltage (UV) sense pin, when below its low threshold limit will immediately cause the GATE pin to be pulled low. The GATE pin will remain low until the voltage on this pin rises above the high threshold limit, initiating a new start-up cycle. VEE - This pin is the negative terminal of the power supply input to the circuit.
1
14
VDD
2
13
TD
3
12
TC
4
11
TB
5
10
RAMP
UV
6
9
GATE
VEE
7
8
SENSE
PWRGD Logic
Model HV302 HV312 Condition INACTIVE (Not Ready) ACTIVE (Ready) INACTIVE (Not Ready) ACTIVE (Ready) PWRGD-A/B/C/D 0 VEE 1 HI Z 1 HI Z 0 VEE
VDD - This pin is the positive terminal of the power supply input to the circuit. TD - The resistor connected from this pin to VEE pin sets the time delay from PWRGD-C going active to PWRGD-D going active. TC - The resistor connected from this pin to VEE pin sets the time delay from PWRGD-B going active to PWRGD-C going active. TB - The resistor connected from this pin to VEE pin sets the time delay from PWRGD-A going active to PWRGD-B going active. RAMP - This pin provides a current output so that a timing ramp voltage is generated when a capacitor is connected. GATE - This is the Gate Driver Output for the external N-Channel MOSFET. SENSE - The current sense resistor connected from this pin to VEE Pin programs the servo control current limit and the circuit breaker trip limit.
3
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Functional Block Diagram
Vint VDD
Internal Supply Regulator UVLO and POR
PWRGD-D
Band Gap Reference
PWRGD-C
Vbg UV
LOGIC Programmable Timer
PWRGD-B
C
Vbg OV
C
555 type Auto-Retry Timer
PWRGD-A
Vint
Latch High & Sleep
10uA Vint-1.2V
Transconductor 1:2 Mirror
C
100mV
C
Circuit Breaker
Transconductor
2Vbg
gm
Buffer
Selector Switch
gm
Selector Switch
VEE
5k
5k
Clamp Mechanism
SENSE
RAMP
GATE
TB TC TD
Functional Description
Insertion into Hot Backplanes Telecom, Networking, SAN and Server applications require the ability to insert and remove circuit cards from systems without powering down the entire system. All circuit cards have some filter capacitance on the power rails, which is especially true in circuit cards or network terminal equipment utilizing distributed power systems. The insertion can result in high inrush currents that can cause damage to connector and circuit cards and may result in unacceptable disturbances on the system backplane power rails. The HV302 and HV312 are designed to facilitate the insertion of these circuit cards or connection of terminal equipment by eliminating these inrush currents and powering up these circuits in a controlled manner after full connector insertion has been achieved Description of Operation During initial power application, a "normally-on" circuit holds off the external MOSFET, preventing an input glitch while an integrated regulator establishes an internal operating voltage of approximately 10V. Until the proper internal voltage is achieved all circuits are held reset, the PWRGD flags are inactive and the gate to source voltage of the external MOSFET is clamped low. Once the internal under voltage lock out (UVLO) has been satisfied, the circuit checks the input supply under voltage (UV) and over voltage (OV) sense circuits to ensure that the input voltage is within programmed limits. These limits are determined by the selected values of resistors R1, R2 and R3, which form a voltage divider. In Servo Mode operation, assuming the UV and OV limits are satisfied and while continuing to hold the PWRGD flags inactive and the external MOSFET GATE voltage low, the current source feeding the RAMP pin is turned on. The external ramp capacitor connected to it begins to charge, thus starting an initial time delay determined by the value of the capacitor and the 2Vbg threshold voltage of the RAMP pin. During this time if the OV or UV limits are exceeded, an immediate reset occurs and the capacitor connected to the RAMP pin is discharged. When the voltage on the RAMP pin exceeds the 2Vbg threshold voltage, the gate drive circuit begins to apply voltage to the gate of the external MOSFET, which begins to turn on when its gate threshold voltage is reached. The resulting output current generates a voltage drop on the sense resistor connected between the SENSE and VEE pins, causing a decrease in the available current charging the capacitor on the RAMP pin. This continuous feedback mechanism allows the output current to rise inverse exponentially over a period of a few hundred microseconds to the sense resistor programmed current limit set point. When the voltage drop on the sense resistor reaches 50mV the RAMP pin current is reduced to zero and the voltage on the RAMP pin will be fixed, indicating that the circuit is in current limit mode. Depending on the value of the load capacitor and the programmed current limit, charging may continue for some time, but may not exceed a nominal 100ms preset time limit. Once the load capacitor has been charged, the output current will drop, reducing the voltage on the SENSE pin, which in turn will increase the RAMP pin current, thus causing the voltage on the capacitor connected to the RAMP pin to continue rising, thereby providing yet another programmed delay.
4
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Functional Description - continued
In Feedback Capacitor Mode operation, assuming the UV and OV limits are satisfied and while continuing to hold the PWRGD flags inactive and the external MOSFET GATE voltage low, the current source feeding the RAMP pin is turned on. The external ramp capacitor (CRAMP) begins to charge and the feedback capacitor (CFB) begins to discharge, thus starting an initial time delay determined by the equivalent value of the capacitors and the 2Vbg threshold voltage of the RAMP pin. During this time if the OV or UV limits are exceeded, an immediate reset occurs, the ramp capacitor is discharged and the feedback capacitor is recharged. When the voltage on the RAMP pin exceeds the 2Vbg threshold voltage, the gate drive circuit begins to apply voltage to the gate of the external MOSFET, which begins to turn on when its gate threshold voltage is reached. However, the source current from the RAMP pin limits the dv/dt of the feedback capacitor (CFB) which, in turn, programs the inrush current limit (ICL) in accordance with the relationship ICL= IRAMP x CLOAD/CFB and thus the dv/dt of the load capacitor. At this point essentially all available current from the RAMP pin flows into the feedback capacitor, thus the voltage on the ramp capacitor and the RAMP pin remains essentially constant, thereby limiting and controlling the gate voltage of the external MOSFET (See Programming Current Limit and Circuit Breaker in Design Information section). When the load capacitor is fully charged the current flowing into the feedback capacitor is reduced and the voltage drop across the MOSFET essentially drops to zero, effectively connecting the feedback capacitor in parallel with the ramp capacitor. Now the current from the RAMP pin flows into the parallel-connected capacitors and the voltage on the RAMP pin begins to rise, thereby providing yet another programmed delay. Whether operating in Servo Mode or Feedback Capacitor Mode, when the ramp voltage is within 1.2V of the regulated internal supply voltage, the controller will force the GATE terminal to a nominal 10V, the PWRGD-A pin will change to an active state and the Circuit Breaker is enabled. PWRGD-B will change to an active state a programmed delay time after PWRGD-A went active, PWRGD-C will change to an active state a programmed delay time after PWRGD-B went active, PWRGD-D will change to an active state a programmed delay time after PWRGD-C went active and the circuit transitions to a low power sleep mode. While in sleep mode the circuit continues to monitor the current and the OV and UV status. When the voltage on the SENSE pin rises to 100mV, indicating an over current condition, the circuit breaker will trip in less than 5s. This time may be extended by the addition of external components. If due to output overload conditions during startup full charging of the load is not achieved within 100ms or a load fault occurs at any time the circuit breaker is tripped, the MOSFET is turned off by pulling down the GATE to VEE and all four PWRGD flags are reset. Thereafter an auto-retry timer, programmed by the capacitor connected to the RAMP pin, will hold the pass device off to allow it to cool before resetting and restarting. The auto-retry can be disabled using a single resistor if desired (See Auto-Retry and Auto-Retry Disable in Design Information section). At any time during the start up cycle or thereafter, crossing the UV and OV limits (including hysteresis) will cause an immediate reset of all internal circuitry. When the input supply voltage returns to a value within the programmed UV and OV limits a new start up sequence will be immediately initiated.
5
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Design Information
Programming Under and Over Voltage Shut Down
The UV and OV pins are connected to comparators with nominal 1.21V thresholds and 100mV of hysteresis (1.21V 50mV). They are used to detect under voltage and over voltage conditions at the input to the circuit. Whenever the OV pin rises above its high threshold (1.26V) or the UV pin falls below its low threshold (1.16V) the GATE voltage is immediately pulled low, the PWRGD pin changes to its inactive state and the external capacitor connected to the RAMP pin is discharged. Calculations can be based on either the desired input voltage operating limits or the input voltage shutdown limits. In the following equations the shutdown limits are assumed. The under voltage and over voltage shut down thresholds can be programmed by means of the three resistor divider formed by R1, R2 and R3. Since the input currents on the UV and OV pins are negligible the resistor values may be calculated as follows:
Under Voltage/Over Voltage Operation
From the calculated resistor values the OV and UV start up threshold voltages can be calculated as follows:
UVON = VUVH = 1.26 = VEEUV(on) x
R2 + R3 R1 + R2 + R3 R3 OVOFF = VOVH = 1.26 = VEEOV(off) x R1 + R2 + R3 Where VEEUV(off) and VEEOV(off) are Under & Over Voltage Shut Down Threshold points. UVOFF = VUVL = 1.16 = VEEUV(off) x
If we select a divider current of 100A at a nominal operating input voltage of 50 Volts then
R2 + R3 R1 + R2 + R3 R3 R1 + R2 + R3
OVON = VOVL = 1.16 = VEEOV(on) x
Where VEEUV(on) and VEEOV(on) are Under & Over Voltage Start Up Threshold points. Then
50V R1 + R2 + R3 = = 500k 100uA
From the second equation for an OV shut down threshold of 65V the value of R3 may be calculated.
VEEUV(on) = 1.26 x
R1 + R2 + R3 R2 + R3
487k + 6.81k + 9.76k = 38.29V 6.81k + 9.76k
VEEUV(on) = 1.26 x
And
OVOFF
R3 =
65 x R3 = 1.26 = 500k
VEEOV(on) = 1.16 x
R1 + R2 + R3 R3
1.26 x 500K = 9.69k 65
VEEOV(on) = 1.16 x
487k + 6.81k + 9.76k = 59.85V 9.76k
The closest 1% value is 9.76k From the first equation for a UV shut down threshold of 35V the value of R2 can be calculated.
Therefore, the circuit will start when the input supply voltage is in the range of 38.29V to 59.85V.
UVOFF = 1.16 =
R2 =
35 x (R2 + R3) 500K
1.16 x 500k - 9.76k = 6.81k 35
The closest 1% value is 6.81k Then
R1 = 500K - R2 - R3 = 483k
The closest 1% value is 487k
6
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Design Information- continued
Programming Current Limit and Circuit Breaker
Feedback Capacitor Mode Operation
Calculate C2 (feedback capacitor) discharge current
IC2 = 10A - ISINK = 10A - 2.5A = 7.5A If Auto-Retry is disabled an adjustment must be made to IC2
IAUTO = Vt 4V = = 1.6A RDISABLE 2.5M
In this operating mode the circuit breaker trip current and the inrush current limit can be independently programmed. In fact the circuit breaker can be completely disabled by setting RSENSE = 0. The circuit breaker will trip in less than 5s when the voltage on the SENSE pin is raised 100mV above the VEE pin and the value of the sense resistor may be calculated from the following equation:
R SENSE = VSENSE-CB 100mV = ICB ICB
Where Vt is the maximum threshold voltage of the MOSFET. Therefore, the adjusted value of IC2 is: IC2 = 10A - ISINK - IAUTO IC2 = 10A - 2.5A - 1.6A = 5.9A In this example we assume that Auto-Retry is enabled and therefore use IC2 = 7.5A. dv dv and ICL = CLOAD x dt dt Since VIN is fixed and VRAMP is constant during limiting, then dv dv across CLOAD = across C2 as they share a common node dt dt and their other terminals are at fixed voltages during inrush current I I I x CLOAD limiting. Therefore, C2 = CL or C2 = C2 . C2 CLOAD ICL As previously calculated and by conservation of charge on RAMP node IC2=7.5A based on the chosen inrush current limit of ICL=1A. Given that CLOAD=100F the required value for C2 can be calculated. Note that IC2 = C2 x Therefore C2 = IC2 x CLOAD 7.5A x 100F = = 0.75nF ICL 1A
For an 8A circuit breaker:
R SENSE = 100mV = 12.5m 8A
The power rating of the sense resistor must be greater than or equal to ICB x VSENSE-CB. The following diagrams depict the equivalent circuitry to clarify the feedback capacitor operation for programming the inrush current limit.
Note that during initial power application the RAMP pin is voltage protected by the capacitive AC voltage divider consisting of CLOAD, C2 and CRAMP and the GATE pin is internally clamped.
Servo Control Mode Operation
The circuit breaker will trip in less than 5s when the voltage on the SENSE pin is raised 100mV above the VEE pin and the value of the sense resistor may be calculated from the following equation:
R SENSE = VSENSE-CB 100mV = ICB ICB
The inrush current limit may be programmed as follows: Choose inrush current limit, for example ICL = 1A Calculate ISINK =
ICL x R SENSE 1A x 12.5m = 2.5A = 5k 5k
For a 2A circuit breaker:
R SENSE = 100mV = 50m 2A
If the Circuit Breaker function is disabled by setting RSENSE = 0, then ISINK = 0A. However, in this example we assume that the Circuit Breaker function is enabled and therefore use ISINK = 2.5A.
The power rating of the sense resistor must be greater than or equal to ICB x VSENSE-CB.
7
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Design Information- continued
The inrush current limit can be calculated as follows:
ICL = VSENSE-CL 50mV = R SENSE R SENSE
The timing functions are defined by the following equations: t START = 2.4 CRAMP IRAMP CRAMP IRAMP
Thus the inrush current limit for a 2A circuit breaker:
ICL 50mV = = 1A 50m
t TH = VGS( th )
Compensation components from gate to source of the external MOSFET may be required to reduce peaking of the inrush current.
t POR = t START + t TH
t RISE
CRAMP I R gfs RAMP - SENSE 0.9I RFB LIMIT CLOAD ILIMIT
t LIMIT VIN
t PWRGD - A = VINT - VGS(LIMIT ) - 1.2
(
)C I
RAMP
RAMP
These equations assume that the load is purely capacitive and the following definitions apply. CRAMP is the external capacitor connected to the RAMP pin.
Compensation can be accomplished as follows: 1. Start with a 2nF capacitor from gate to source. 2. Increase capacitor value up to 10nF if needed. 3. If needed, add a 1k resistor in series with the above capacitor.
IRAMP is the output current from the RAMP pin, nominally 10A, when the voltage drop on RSENSE resistor is zero. VINT is the internally regulated supply voltage and can range from 9V to 11V. VGS(th) is the gate threshold voltage of the external pass transistor and may be obtained from its datasheet. VGS(limit) is the external pass transistor gate-source voltage required to obtain the limit current. It is dependent on the pass transistor's characteristics and may be obtained from the transfer characteristics on the transistor datasheet. gfs is the transconductance of the external pass transistor and may be obtained from its datasheet. RFB is the internal feedback resistor and is nominally 5K. ILIMIT is the load current when the voltage drop on RSENSE resistor is 50mV. These equations may be used to calculate the minimum value of CRAMP for the most critical system performance characteristics. For maximum contact bounce duration protection choose a value for tPOR and use the following equation:
CRAMP = t POR x IRAMP 2.4 + VGS(limit )
Servo Mode Timing
If control of PWRGD active delay is the critical system parameter, then choose a value for tPWRGD-A and use the following equation: CRAMP = t PWRGD - A x IRAMP VINT - VGS(limit ) - 1.2
8
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Design Information - continued
Start up Overload Protection
Start up must be achieved within a nominal 100ms as indicated by the PWRGD-A pin transition to the active state or the circuit will reset and an Auto-Retry will initiate. If there is an output overload or short circuit during start up, the circuit will be in current limit mode for the 100ms time limit (in servo mode). In feedback capacitor mode the circuit breaker will shutdown the MOSFET before 100ms. The following waveforms demonstrate the sequencing of the PWRGD flags. These results were obtained with RTB = 120k, RTC = 60k and RTD = 3k
Circuit Breaker Delay
The circuit breaker will trip in less than 5s when the voltage on the SENSE pin reaches a nominal 100mV. A resistor in series with the SENSE pin and a capacitor connected between the SENSE and VEE pins may be added to delay the rate of voltage rise on the SENSE pin, thus permitting a current overshoot and delaying Circuit Breaker activation. This method is particularly useful when operating in Feedback Capacitor Mode. However, in Servo Mode operation it will result in a current limit leading edge overshoot.
Auto-Retry and Auto-Retry Disable
The Auto-Retry delay time is directly proportional to the capacitance at the RAMP pin. Auto-Retry sequence is activated whenever the 100ms timeout is reached during start up or the Circuit Breaker is tripped. Auto-Retry can be approximated as a 555-timer with 2.5A charge up and charge down currents through 8V, to a count of 256. The value of the resistors determines the capacitor charging and discharging current of a triangle wave oscillator. The oscillator output is fed to an 8-bit counter to generate the desired time delay. The respective delay time is defined by the following equation: t TX = and ICD = Where Therefore, t Auto-Re try = For CRAMP = 10nF t Auto-Re try = 2 x 8 x 256 x 10nF = 16.4s 2.5A 2 x 8 x 256 x CRAMP 2.5A Vbg 4R TX 255 x 2 x C OSC x VPP ICD
tTX = Delay Time between respective PWRGD flags COSC = 120pF (Internal oscillator capacitor) VPP = 8.2V (Peak-to-Peak voltage swing of oscillator) ICD = Charge and Discharge current of oscillator Vbg = 1.2V (Internal Band Gap Reference) RTX = Programming resistor at TB, TC or TD pin
Combining the above two equations and solving for RTX yields: R TX = B bg x t TX 2040 x CPP x VPP = 1.2V x t TX 2040 x 120pF x 8.2V
Due to the 2.5A maximum charge current a resistor which draws more than 2.5A below 8V will disable Auto-Retry. Try to keep this resistor as big as possible, e.g. 2.5M. For most MOSFETs with maximum Vt of 4V, this will vary the 10A RAMP current source by 4V = 1.6A only 2.5M
R TX = 0.6 x 10 6 x t TX For a delay time of 200ms we get: R TX = 0.6 x 10 6 x 200 x 10 -3 = 120k For a delay time of 5ms we get: R TX = 0.6 x 10 6 x 5 x 10 -3 = 3k
PWRGD Flag Delay Programming
Shortly after current limiting ends, PWRGD-A becomes active indicating successful completion of the Hotswap operation. PWRGD-B will change to an active state a programmed delay time after PWRGD-A went active, PWRGD-C will change to an active state a programmed delay time after PWRGD-B went active and PWRGD-D will change to an active state a programmed delay time after PWRGD-C went active. Resistors connected from the respective TB, TC and TD pins to VEE pin are used to program the delay times between the PWRGD flags sequentially going active.
(
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9
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
HV302 / HV312 Design Information - continued
Supported External Pass Devices
The HV302 and HV312 are designed to support N-Channel MOSFETs and IGBTs.
Selection of External Pass Devices
The RDS(ON) of the device is likely to be selected based on allowable voltage drop at maximum load (ILOAD(MAX)) after the Hotswap action has been completed. Thus the required continuous power dissipation rating (PCONT) of the device can be determined from the following equation:
PCONT = RDS( ON) x I2LOAD(MAX ) The peak power rating (PPEAK) should be based on the highest current level, which is always the circuit breaker trip set point (ICB), and on the assumption that a output is shorted. The peak power rating may be calculated from the following equation: PPEAK = VIN x ICB Given these values an external pass transistor may be selected from the manufacturers data sheet.
Paralleling External Pass Transistors
Due to variations in threshold voltages and transconductance characteristics between samples of MOSFETs, reliable 50% current sharing is not achievable. Some measure of paralleling may be accomplished by adding resistors in series with the source of each device; however, it will cause increased voltage drop and power dissipation.
Paralleling of external Pass devices is not recommended!
If a sufficiently high current rated external pass transistor cannot be found then increased current capability may be achieved by connecting independent Hotswap circuits in parallel, since they act as current sources during the load capacitor charging time when the circuits are in current limit. For this application the HV302 with active high PWRGD is recommended where the PWRGD pins of multiple Hotswap circuits can be connected in a wired OR configuration.
Kelvin Connection to Sense Resistor
Physical layout of the printed circuit board is critical for correct current sensing. Ideally trace routing between the current sense resistor and the VEE and SENSE pins should be direct and as short as possible with zero current in the sense traces. The use of Kelvin connection from SENSE pin and VEE pin to the respective ends of the current sense resistor is recommended.
To To VEE SENSE Pin Pin
To Negative Terminal of Power Source
To Source of MOSFET Sense Resistor
10
Rev. D
04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com


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